About The Workshop
The HiPER-3D workshop will explore foundational and emerging aspects of high-performance, energy-efficient 3D chiplet architectures. Topics include scalable workload architectures, energy-efficient design for power and thermal challenges, chiplet integration tools, and real-world applications in AI, HPC, and more. The workshop aims to unite academia and industry, fostering collaboration to advance 3D chiplet technologies. Submissions addressing these areas or offering cross-cutting insights are encouraged.
Call For Papers
The primary objective of this workshop is to bring together cutting-edge research and development from academia and industry, fostering closer collaboration to advance these technologies. Submissions that address these areas or present cross-cutting insights are particularly encouraged.
Topics
We encourage submissions that address a broad range of topics related to high-performance and energy-efficient 3D chiplet architectures, including but not limited to:- EDA for AI
- AI for EDA
- Novel 3D chiplet architectures for Distributed Computing
- HPC and AI/ML workloads
- High-performance interconnect designs for chiplet-based systems
- Processor and Memory co-design in 3D Stacked Systems
- Power-aware design Methods & Dynamic Power Management
- Thermal management strategies for 3D systems
- Energy-performance trade-offs in multi-chiplet systems
- EDA tools for 3D chiplet design, simulation, and verification
- Performance and energy modeling frameworks
- Case studies of 3D chiplet deployments in AI, HPC, and Edge Computing
- Distributed Systems leveraging 3D chiplet architectures
Submission
All papers can be submitted via the EasyChair Submission Portal
Important Dates
- Paper Abstract Registration: 26th February 2025
- Deadline for submit full text: 5th March 2025
- Notification of paper acceptance: 2nd April 2025
- Camera-ready paper submissions: 16th April 2025
- Workshop Date: 20th July 2025
Submision Guidelines
Submissions to the Workshop must be original and unpublished and must not be submitted concurrently for publication elsewhere. All submissions should follow the IEEE 8.5″ x 11″ two-column format using 10pt fonts and the IEEE Conference template (downloadable by selecting “Conferences” in the IEEE-Template Selector https://template-selector.ieee.org/). Each submission can have up to 6 pages (including figures, tables, appendices, and references). Submissions exceeding this page limit or with smaller fonts will be desk-rejected without review. The review process is single-blind review.
For each accepted paper, at least one author is required to register and attend the workshop in-person to present their poster/paper on-site. No-show paper will be reported to the publisher and removed from the ICDCSW companion conference proceedings. All accepted and presented papers will be included in the IEEE ICDCSW companion conference proceedings and IEEE digital library.
Note that the authors should adhere to ethic and professional standards of IEEE. Please refer to IEEE Code of Ethics and IEEE Policy of AI-Generated Text.